The urgency around heat dissipation stems from simple physics: as computing power grows, so does energy consumption. According to the Institute for Information Industry, a single GB200 NVL72 rack—housing 36 Grace CPUs and 72 Blackwell GPUs—generates 116 kilowatts (kW) of power. Traditional air cooling, however, can only handle 20 kW of thermal load, creating a near 6x cooling gap. This mismatch has made liquid cooling a non-negotiable priority for manufacturers in the AI and data center sectors.
Air cooling remains the most widely adopted method in data centers and enterprise server rooms. It works by using fans, heat sinks, and heat pipes to dissipate heat—akin to “air conditioning for servers.” For high-performance needs, advanced techniques like 3D VC (Vapor Chamber) combine heat pipes with vacuum-sealed chambers and multiple fans to maximize efficiency.
- Physical Limits: While higher airflow speeds enhance heat convection, they amplify vibration and noise (often exceeding 80 dB), compromising server longevity and workplace safety.
- Market Transition: Air cooling still serves niche applications (e.g., NVIDIA H100 chips), but the launch of power-hungry GB-series chips is accelerating its replacement by liquid cooling.
Also known as Direct Liquid Cooling (DLC), this technology has become essential for high-density computing. It splits into two primary types:
- How It Works: Coolant absorbs heat from chips via pipelines, then transfers it to fan-backed doors at the rear of server racks for air dissipation.
- Adoption: Used by 60–70% of data centers today, it requires minimal infrastructure changes (just adding fan walls) but faces noise issues (90–100 dB, comparable to heavy traffic).
- How It Works: Sealed loops with thermal copper plates (“cold plates”) circulate coolant to exchange heat between components. Unlike water-to-air, it eliminates fan walls, reducing noise and improving space efficiency.
- Industry Adoption: NVIDIA’s GB200 NB072 chip uses this method, with major OEMs like Supermicro, Wiwynn, and Inventec investing heavily in the architecture.
Immersion cooling offers a radical solution: submerging entire servers in non-conductive dielectric fluid to cool chips, CPUs, and memory modules simultaneously. While it promises unmatched efficiency, challenges remain:
- Technical Barriers: Environmental concerns about fluid disposal, long-term reliability of submerged electronics, and unclear maintenance protocols.
- Infrastructure Costs: Requires redesigned facilities with reinforced floors and integrated water/electrical systems, making it a high-investment option for large-scale data centers.
As demand for efficient cooling grows, manufacturers must balance quality and affordability. At BY Thermal, we specialize in custom solutions using two core materials:
- Copper: Ideal for high-performance applications due to its superior thermal conductivity.
- Aluminum: Popular for lightweight, cost-effective designs that balance performance and budget.
By optimizing material science and engineering, we deliver tailored heat sinks and cooling systems that meet diverse industry needs—from AI servers to industrial electronics.
Ready to future-proof your projects? Partner with us to leverage cutting-edge thermal solutions that outperform competitors. Whether you need air, liquid, or custom cooling designs, we ensure innovation at every stage—from concept to production.
Contact us today to explore how our expertise in copper and aluminum cooling can elevate your manufacturing efficiency and sustainability.
