Copper High-Density Skived Fin Heat Sink Cooling Solutions

A Copper High – Density Skived Fin Heat Sink offers an excellent alternative to extruded heat sinks. Why? Because extrusion technology can’t achieve high – density fins, high – performance, and a high aspect ratio. But our skived copper heat sink can!

The fabrication of skived heat sinks has a major advantage. It doesn’t require an expensive mold, which gives us greater design flexibility. Instead, we use the same tool to cut each fin separately. This way, we can keep tooling costs low.

Moreover, this skived copper heat sink is made of copper, a material with higher thermal conductivity than aluminum. Plus, it has ultrathin fins. The skiving process makes it a great thermal solution for cooling high – power devices.

Our Copper High – Density Skived Fin Heat Sink is widely used in various applications. It’s great for computers, power transistors, FETs, ICs, power amplifiers, voltage regulators, servers, SCRs, and more. If you’re looking for reliable cooling solutions, our skived heat sink is the way to go.