High-performance cold plate assembly designed for next-generation AI computing and ultra-high heat flux GPU cooling
This advanced microchannel liquid cooling assembly is engineered for high-density AI server applications, delivering efficient heat dissipation for GPU and high-power components.
Designed with precision flow distribution and multi-block integration, it ensures:
- Uniform temperature control
- High heat transfer efficiency
- Reliable long-term operation
Ideal for AI infrastructure, HPC systems, and next-generation data centers.
What We Can Do
- Simulations for design feasibility
- Thermal design optimization
- CAD design and modeling
- Design for manufacturing (DFM) for better reliability and low cost
- Jigs and fixture design for optimum output
- CNC programming and machining
- Manufacturing
- Microchannel machining
- CNC precision manufacturing
- Brazing & sealing technology
- Custom manifold & flow path design
Applications
- AI servers & GPU clusters
- High-performance computing (HPC)
- Data centers
- Advanced semiconductor systems
We provide full customization:
- Channel design optimization
- Material selection (Aluminum / Copper)
- Interface & connector customization
- Prototype to mass production
→ Looking for a reliable liquid cooling partner for AI infrastructure?
