Friction Stir Welding Aluminum Liquid Cold Plate for Semiconductor: High – Performance Cooling Solution

Our Friction Stir Welding Aluminum Liquid Cold Plate for Semiconductor is made from AL6063 aluminum. This material offers excellent thermal conductivity and durability.

First, we use precision deep hole drilling to create a longitudinal channel on the base plate. Then, we mill both ends of the transverse interval. After that, we apply advanced friction stir welding technology to seal the channels seamlessly.

This innovative method boosts compressive strength. Also, it enables thinner designs. As a result, it’s an ideal choice for high – power fiber laser cooling systems in the semiconductor industry. We’re committed to providing top – notch products that meet the cooling needs of modern semiconductor applications. With our cold plate, you get reliability and efficiency in one package.