Custom Heat Sink & Cold Plate Manufacturing:
Built to your drawings. Optimized for manufacturability. Manufactured for reliable performance.

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BY Thermal’s main products: skived fin heatsinks, extruded aluminum heatsinks, liquid cooling plates, stamping heatsinks, heat pipe heatsinks, and CNC-machined components.

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Personalized Vacuum Brazing High Density Microchannel Water Cooling Heatsink

microchannel heatsink

Vacuum Brazed Microchannel Cold Plate | Custom Liquid Cooling Heatsink - BY Thermal

What is the typical lead time for custom microchannel cold plates?
Standard prototypes typically ship in 2-3 weeks. Production quantities range from 4-6 weeks depending on complexity and volume. Rush services are available for urgent projects.
Can you provide thermal simulation and design support?
Yes, our engineering team offers CFD thermal simulation services to optimize your cold plate design. We can analyze flow distribution, pressure drop, and thermal performance before manufacturing.
What materials do you use for vacuum brazed cold plates?
We primarily use C1100/C1020 copper for maximum thermal conductivity and AL6061/3003 aluminum for weight-sensitive applications. Other materials like stainless steel are available for special requirements.
What is the minimum order quantity (MOQ)?

We have no mandatory MOQ. However, higher order quantities will bring down the unit cost accordingly.

Do you offer custom surface treatments and coatings?
Yes, available finishes include electroless nickel plating (for corrosion resistance), chromate conversion coating, hard anodizing (aluminum), and various passivation treatments.

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BY Thermal specializes in manufacturing high-performance vacuum brazed microchannel cold plates for high-heat-flux applications up to 500W/cm². Our precision-engineered liquid cooling heatsinks deliver superior thermal performance for IGBT modules, data center servers, EV battery packs, and laser systems. With advanced vacuum brazing technology and fully customizable designs, we provide reliable thermal solutions tailored to your specific requirements.

What is a Vacuum Brazed Microchannel Cold Plate?

copper microchannel skiving fin heatsink liquid cold plate
A vacuum brazed microchannel cold plate is an advanced liquid cooling component that uses precision-machined microchannels (typically 0.08-0.3mm hydraulic diameter) to maximize heat transfer surface area. The vacuum brazing process creates a metallurgical bond between the channel structure and the cover plate, ensuring leak-free operation with minimal thermal resistance.
 
Unlike traditional tube-and-plate or extrusion cold plates, our vacuum brazed microchannel design offers:
– **Higher heat flux capacity**
– **Lower thermal resistance**
– **Uniform temperature distribution**
– **Compact form factor**
– **High pressure tolerance**
 
Our microchannel cold plates are manufactured using high-purity copper (C1100, C1020) or aluminum alloys (AL6061/3003), selected based on your application requirements for thermal conductivity, weight, and corrosion resistance.

Key Features & Technical Advantages

– Channel widths as small as 0.05mm for maximum surface area
– Optimized flow paths for uniform coolant distribution
– Turbulent flow enhancement for improved heat transfer
– Customizable channel patterns (serpentine, parallel, pin-fin)
 
2. Advanced Vacuum Brazing Technology
– Metallurgical bond eliminates interface thermal resistance
– 100% leak-tested under helium mass spectrometry
– Oxidation-free bonding in controlled vacuum environment
– Strong, durable joints with high mechanical strength
 
3. Fully Customizable Solutions
– Custom dimensions from 20mm to 300mm
– Various port configurations (barb, compression, threaded)
– Integrated mounting features and alignment pins
– Surface finishes: nickel plating, chromate conversion, anodizing
 
4. Superior Thermal Performance
– Thermal resistance as low as 0.05°C·cm²/W
– Heat flux capacity up to 500W/cm²
– Temperature uniformity within ±1°C
– Compatible with water, glycol, and dielectric coolants
 
Custom Copper Aluminum Skived Fin Heat Sink Microchannel Cold Plate

Applications & Industries

Power Electronics & IGBT Modules
 
– IGBT and MOSFET cooling for inverters and converters
– UPS and power supply systems
– Motor drives and servo controllers
– Renewable energy inverters (solar, wind)

Data Center & High-Performance Computing

– CPU and GPU liquid cooling for servers
– AI accelerator and HPC clusters
– High-density data center racks
– Edge computing and 5G infrastructure
Electric Vehicles & Battery Systems
 
– EV battery pack thermal management
– Motor controller and inverter cooling
– On-board chargers and DC-DC converters
– Fuel cell thermal systems
Laser & Medical Equipment
 
– High-power laser diodes and optics
– Medical imaging systems (MRI, CT)
– Analytical and testing equipment
– Aerospace and defense electronics

Why Choose BY Thermal as Your Cold Plate Supplier?

Engineering Expertise
 
– 10+ years of thermal design experience
– In-house R&D team with CFD simulation capabilities
– Design for manufacturing (DFM) optimization
– Prototyping support with fast turnaround
Manufacturing Capabilities
 
– Advanced vacuum brazing furnaces
– High-precision CNC machining centers
– Automated quality inspection systems
– Scalable production from prototypes to mass production
Quality Assurance
 
– ISO 9001:2015 certified
– 100% leak testing on all products
– Full material traceability
– Comprehensive quality documentation
Customer Support
 
– Dedicated technical account managers
– Fast response times (24 hours)
– Flexible MOQ requirements
– Global shipping and logistics support

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High Efficiency Water Cooling Suite for Machines Cooler System

High Efficiency Water Cooling Suite for Machines Cooler System

High Efficiency Copper Water Cooling Suite for Machines Cooler System

Type
Brand Name
Model Number
Place of Origin
Packing
Application
Payment
Delivery Time
Quality Guarantee

Liquid Cold Plate

BY Thermal

BYLCP061101

Guangdong, China (Mainland)

Carton, Blister tray, Wooden pallet

servers, telecom, medical equipment, transportation, lasers, etc

T/T

Shipped in 7-15 days after payment

1 years (man-made damage, accessories will be charged separately)

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High Efficiency Water Cooling Suite for Machines Cooler System

What is a water block?

High Efficiency Water Cooling Suite for Machines Cooler System
Liquid cooling systems have revolutionized heat management for high – performance electronics, and at the heart of these systems lies the water block. Let’s explore its functions, design, and impact on thermal efficiency, while addressing key readability and SEO – friendly adjustments.
Primary Function: Heat Transfer Redefined
The water block serves as a critical heat exchanger. Its main task is to transfer heat from components like CPUs or GPUs to a circulating coolant (often water – based). Unlike basic air cooling (relying on fans and heatsinks), it enables quieter, more efficient thermal regulation—perfect for overclocked setups or noise – sensitive environments.
Structural Design: Components Working in Tandem
A standard water block consists of several key parts:

 

  • Conductive Base Plate: Usually made of copper (for top – tier thermal conductivity, ~401 W/m·K) or aluminum (lighter, cheaper, but ~237 W/m·K conductivity). It directly contacts the heat – generating component, so a polished surface minimizes thermal resistance.
  • Internal Flow Channels: These pathways (serpentine, micro – fin, or mesh designs) maximize coolant – to – base contact. Turbulence here boosts heat transfer, though balancing flow rate and turbulence is crucial.
  • Fittings and Mounting: Inlet/outlet ports (e.g., G1/4 threads) connect to tubing, while brackets secure the block to components like CPU sockets.

 

Operational Principles: The Cooling Cycle
Here’s how the water block fits into the liquid cooling loop:

 

  1. Heat Absorption: As the component heats up, the base plate draws in thermal energy and transfers it to the coolant.
  2. Coolant Circulation: The now – warm coolant flows to a radiator, where air (or liquid) dissipates the heat. A pump then circulates the cooled fluid back to the block.
  3. Efficiency Factors: Channel design, coolant type (distilled water + additives to prevent corrosion), and proper thermal paste application all impact performance.
High Efficiency Water Cooling Suite for Machines Cooler System 2

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Thermal Management Solution Aluminium Anodizing Copper Skived Fin Heat Sink

Skiving Fin Heatsinks Collection

Thermal Management Solution Aluminium Anodizing Copper Skived Fin Heat Sink

Type
Brand Name
Model Number
Place of Origin
Packing
Application
Payment
Delivery Time
Quality Guarantee

Skiving Fin Heatsink

BY Thermal

BYSH060901

Guangdong, China (Mainland)

Carton, Blister tray, Wooden pallet

servers, telecom, medical equipment, transportation, lasers, etc

T/T

Shipped in 7-15 days after payment

1 years (man-made damage, accessories will be charged separately)

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Thermal Management Solution Aluminum Anodizing Copper Skived Fin Heatsink

What is a skiving fin heatsink?

fin

Structure
It consists of a base plate and numerous thin fins tightly arranged on it. We cut and bend a single piece of material to form these fins. This design maximizes the heat – dissipating surface area while keeping the structure compact.


Manufacturing process
To manufacture skiving fin heatsinks, we use the skiving process. First, feed a solid block of material (like aluminum or copper) into a machine with sharp cutting tools. These tools shave off thin layers of the material and bend them into fins in one go. During this process, we can precisely control the thickness, height, and spacing of the fins.

High – efficiency heat dissipation
First, thanks to the high fin density and thin fins, the heatsink’s surface area gets a huge boost. Then, it can actively conduct heat to the heatsink surface quickly. After that, the heat releases into the air via convection. This way, the heatsink achieves excellent heat – dissipation performance.


Design flexibility
The skiving process brings design flexibility. It can actively create heatsinks with complex geometries and custom fin patterns. You can optimize these designs according to specific application scenarios. In the end, they meet different heat – dissipation requirements.


Cost – effectiveness
This process has an edge in cost – effectiveness. It produces no waste material. Compared with some other manufacturing processes (like extrusion, stamping, or bonding), it actively keeps costs lower. Especially for small – batch and large – sized heatsinks, it can help you save expensive mold costs.

copper fin

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CNC MACHINED PARTS

CNC MACHINED PARTS

customize CNC MACHINED PARTS heatsink

What is a CNC machining?

 

CNC machining (Computer Numerical Control) is a production process that uses computer-controlled machine equipment for automated processing. Engineers control the running trajectory and processing direction of various cutting tools through pre-set programs, which can achieve precision cutting and shaping of metal materials, plastic materials, and other materials. Especially after the concept of Industry 5.0 was proposed, higher requirements were placed on the accuracy and difficulty of CNC machining.

The key steps of CNC machining include designing computer-aided design (CAD) software to develop machining paths, converting designs into computer-assisted manufacturing (CAM) software that machines can understand, and utilizing CNC systems to precisely control the motion of machine tools and cutting operations of cutting tools.

Custom CNC Machined Services

In the face of the rapid development of the industry, the demand for CNC machining parts has been on the rise. Our company is well – positioned to meet the diverse needs of our customers throughout this process.

Backed by over 10 years of processing experience, we are able to offer our customers a stable and reliable product certification guarantee. Our products are meticulously processed in strict accordance with the requirements of the ISO 9001:2015 certification system. Moreover, all our product materials are environmentally friendly, complying with the ROHS standard. This commitment to environmental friendliness extends to our surface treatment processes, such as anodizing and passivation treatment, which are also carried out in line with environmental protection requirements.
 
In essence, we are not merely experts in thermal management production. We are also seasoned CNC machining experts, capable of providing a wide range of diversified services to fully meet the processing needs of our customers.
CNC MACHINEd parts
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When manufacturing CNC – machined parts, we need STEP, SLDPRT,  PRT and CAD drawings. They are essential for ensuring accurate part production.

CUSTOM HEATSINKS

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PRODUCT Liquid Cooling Loop and Cold Plate Direct to Chip for Artificial Intelligence Processors

Liquid Cooling Loop and Cold Plate Direct to Chip for Artificial Intelligence Processors

Liquid Cooling Loop and Cold Plates Direct to Chip for Artificial Intelligence Processors

Type
Brand Name
Model Number
Place of Origin
Packing
Application
Payment
Delivery Time
Quality Guarantee

Liquid Cold Plate

BY Thermal

A0031301

Guangdong, China (Mainland)

Paper carton with wooden pallet

Liquid cooled server, AI processors

T/T, PayPal

Shipped in 7-15 days after payment

1 years

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Product Description

Liquid Cooling Loop and Cold Plate Direct to Chip for Artificial Intelligence Processors

Liquid Cooling Loop and Water Cold Plate Direct to Chip for Artificial Intelligence Processors

  • High cooling efficiency: It directly transfers the heat from the processor to the cooling liquid, which significantly reduces thermal resistance. Compared with traditional air – cooling systems that need a large number of fans and radiators to maintain the optimal temperature, it can cool the chip more effectively.
  • Energy – saving and cost – effective: By improving cooling efficiency, direct to chip liquid cooling loop can significantly reduce energy consumption. This helps to save long – term operating costs for data centers or other equipment using this technology.
  • Scalability and modularity: With a modular design of the coolant distribution unit (CDU), data centers can gradually upgrade their cooling infrastructure without major facility renovations, which is convenient for future expansion and optimization.
  • Environmental – friendly: The closed – loop coolant circulation system used in direct to chip liquid cooling loop minimizes water consumption. If the data center has an adequate water source, liquid – to – liquid single – phase cooling units (L2L CDUs) can further enhance performance and sustainability, making it a more environmentally friendly option.
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STANDARD HEATSINKS

STANDARD HEATSINKS

Skived heat sinks, crafted from premium aluminum or copper, provide seamless, single-piece cooling solutions designed for superior thermal performance without the limitations of thermal barriers.

These heat sinks excel in enhancing cooling efficiency by enabling higher fin densities compared to extrusion methods, while eliminating the interface joints commonly found in bonded or brazed fin heat sinks, which can obstruct heat transfer. The manufacturing process involves a precise technique called skiving, where the base material is finely sliced, with each section folded perpendicularly to form fins. This process is repeated at regular intervals to achieve the desired fin structure.

The skiving process facilitates the creation of heat sinks with high fin density and thin fin geometries, optimizing thermal performance to its fullest potential. By maximizing the fin surface area within a compact volume, skived heat sinks deliver exceptional heat dissipation, outperforming other single-piece designs, such as extruded aluminum heat sinks. Unlike extrusion, the skiving process does not require costly tooling, allowing for greater design flexibility and rapid prototyping. Each fin is individually cut using the same tool, significantly reducing tooling expenses while maintaining precision and quality.

CUSTOM HEATSINKS

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OTHER HEATSINKS

OTHER HEATSINKS

Advanced Heatsink Manufacturing Techniques for Efficient Thermal Management
Beyond traditional methods like skived, extruded, water-cooled, stamped, and machined heat sinks, modern thermal management relies on innovative processes to address high-power density challenges. Here’s a concise overview of alternative heat sink technologies that enhance performance and scalability.
 

1. Die-Cast Heat Sinks

Die casting produces complex, integrated heat sink structures by injecting molten aluminum or copper into precision molds. This method enables high-volume production of fins, bases, and mounting features in a single step, ideal for automotive electronics, LED lighting, and industrial equipment. Die-cast designs optimize surface area while maintaining structural integrity, ensuring reliable heat dissipation for applications with tight space constraints.
 

2. Chemically Etched Heat Sinks

Chemical etching creates ultra-thin, intricate fin arrays by selectively dissolving metal layers using acidic solutions. This process achieves micron-level precision, making it suitable for compact devices like 5G modules and medical electronics. Etched heat sinks excel in thermal uniformity and low-profile designs, eliminating burrs and reducing thermal resistance compared to traditional machining.
 

3. 3D-Printed Heat Sinks

Additive manufacturing (3D printing) allows customization of heat sink geometries, including fractal fins, lattice structures, and conformal cooling channels. This technology is pivotal for AI accelerators and high-end GPUs, where tailored designs enhance heat dissipation efficiency by up to 40%. 3D-printed heat sinks also reduce material waste and enable rapid prototyping for niche applications.
 

4. Microchannel Cooling Plates

Microchannel heat sinks feature submillimeter fluid channels etched into copper or aluminum blocks, delivering 10x higher heat transfer rates than conventional designs. Widely used in aerospace and data centers, these plates manage thermal hotspots in high-power semiconductors by leveraging laminar flow and large surface-area-to-volume ratios. Their compact size and scalability make them critical for next-gen electric vehicles and renewable energy systems.
 

5. Nanocoated Heat Sinks

Nanocoatings, such as carbon nanotube or ceramic-based layers, enhance radiative heat transfer and corrosion resistance. Applied via spray or dip-coating, these thin films (0.1–10μm) improve thermal emissivity by 20–30%, extending the lifespan of outdoor electronics and LED fixtures. Nanocoated heat sinks are lightweight and compatible with existing manufacturing workflows, offering cost-effective thermal optimization.
 

6. Thermosyphon Cooling Systems

Thermosyphons utilize phase-change dynamics to transfer heat passively. A sealed chamber with a working fluid (e.g., water) evaporates at the heat source and condenses at the cooled fins, creating a natural circulation loop. This pump-free solution is ideal for server racks and solar inverters, providing reliable cooling with minimal energy consumption.
 

7. Electromagnetic Forming Heat Sinks

Electromagnetic forming uses high-velocity magnetic fields to shape metal sheets into complex fin configurations. This non-contact process ensures uniform stress distribution and tight tolerances, making it suitable for automotive powertrains and consumer electronics. Electromagnetic forming reduces material fatigue and enables seamless integration of heat sinks with other components.
 

8. Metal Matrix Composite (MMC) Heat Sinks

MMCs combine aluminum or copper with ceramic reinforcements (e.g., silicon carbide) to achieve thermal conductivity exceeding pure metals. These composites excel in aerospace and defense applications, where high thermal stability and low weight are critical. MMC heat sinks also resist thermal expansion, ensuring long-term reliability in extreme environments.
 

9. Injection-Molded Plastic Heat Sinks

Plastic heat sinks, reinforced with graphite or metal fillers, offer lightweight alternatives for low-power devices. Injection molding allows mass production of intricate shapes, making them cost-effective for IoT sensors and wearables. While less thermally conductive than metals, these designs optimize airflow and reduce electromagnetic interference (EMI).
 

10. Ultrasonic Welded Heat Sinks

Ultrasonic welding joins fins to bases using high-frequency vibrations, creating robust bonds without adhesives or solder. This method minimizes thermal resistance and ensures structural integrity, vital for high-vibration environments like industrial machinery and electric vehicles.
By adopting these advanced techniques, engineers can tackle rising thermal demands in AI, 5G, and renewable energy sectors. Each process balances performance, cost, and scalability, ensuring optimal thermal management for diverse applications.
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