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News Highlights on Liquid Cooling Systems

JetCool Unveils New Liquid Cooling System

On May 20, 2025, JetCool, a Flex company, actively launched the next – generation Smart Plate system at Dell Technologies World. This self – contained liquid – cooling solution is now available for select Dell PowerEdge systems. It’s a fully sealed, direct – to – chip liquid – cooling setup that can promptly boost performance and efficiency. Significantly, it doesn’t need any changes to data center infrastructure and requires no facility water. In third – party thermal testing, it effectively saved an average of 15% in IT power consumption.

KAORI Thermal Presents Liquid Cooling Solutions

From May 20 – 23, 2025, KAORI Thermal Technology successfully showcased its latest liquid – cooling solutions at COMPUTEX 2025. These solutions are specifically compatible with gb 200, gb 300, and orv3 architectures. They are mainly designed to meet the rapidly rising thermal management needs of AI servers and high – performance computing. The showcased systems include rear – door air – to – liquid heat exchangers, side – car modules, direct – to – chip in – rack CDU systems, high – capacity in – row CDU units, and immersion – cooling systems.

NVIDIA’s Blackwell Platform to Drive Liquid Cooling

According to TrendForce, NVIDIA’s Blackwell platform, which launched in Q4 2024, will strongly drive liquid – cooling adoption. Liquid – cooling penetration was merely around 10% in 2024 but is projected to exceed 20% in 2025. The new platform has a relatively high energy consumption, especially for the gb200 full – rack solution. Thus, it will clearly promote the use of liquid – cooling systems for more efficient cooling.

Data Center Liquid Cooling Market Growth

A Dell’Oro Group report from July 2024 reveals that the data center liquid – cooling market has actually reached an inflection point. Mainstream adoption started in H2 2024. In the next five years (2024 – 2028), the market opportunity will actually top $15 billion. Single – phase direct – to – chip liquid cooling is currently the leading technology, and its deployment is scaling up first. Other liquid – cooling forms, like single – phase immersion and two – phase direct – to – chip liquid cooling, are also gradually emerging.
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DC CIME 2026 Shenzhen expo heatsink booth 14H68 | Custom AI Data Center Cooling Supplier

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DC CIME 2026 Shenzhen expo heatsink booth 14H68

We sincerely invite global buyers to visit us at DC CIME 2026 Shenzhen expo heatsink booth 14H68 from June 10 to 12 at Shenzhen World Exhibition & Convention Center.
 
As a professional aluminum skiving heatsink factory, BY Thermal showcases high-density GPU server radiators, custom liquid cooling cold plates, CNC thermal modules and coated heat sinks at booth 14H68. Our overseas sales and thermal engineering team offer free on-site technical consultation for OEM/ODM cooling solutions.
 

Overseas purchasers from USA, EU, Japan and Southeast Asia are welcome to schedule one-on-one project talks. Secure exclusive expo pricing for bulk heatsink orders placed on-site. Scan our invitation QR code to pre-book your visit and get our full product catalog.

 

Expo theme: AI Drives Innovation, Liquid Cooling Empowers the Future.

 

Exhibition Details

Exhibition: DC CIME 2026 Shenzhen Thermal Expo
Date: Jun 10-12, 2026
Location: Shenzhen World Exhibition & Convention Center (Hall 14–16)
Booth Number: 14H68
Company: BY Thermal (Dongguan Baoyue Technology Co., Ltd.)

Discover Advanced Thermal Solutions

At the exhibition, BY Thermal will showcase a range of advanced thermal management products designed for high-performance applications, including:

• Skived heat sinks
• Liquid cold plates
• Copper heat sinks
• Custom thermal solutions

Our products are widely used in laser equipment, power electronics, AI servers, energy storage systems, and industrial applications.

Why Visit BY Thermal at the Exhibition

Visitors to our booth will have the opportunity to:

• Explore high-density skived heat sink technology
• Learn about custom liquid cooling solutions
• Discuss project requirements with our engineering team
• Discover cost-effective and high-performance cooling designs

Our team will be on-site to provide technical insights and customized recommendations for your thermal management challenges.

About BY Thermal

BY Thermal is a professional manufacturer specializing in thermal management solutions, including skived heat sinks and liquid cooling systems.

With over 10 years of experience, we provide high-quality products and customized solutions for global customers in industries such as laser systems, electronics, and renewable energy.

FAQ
Q1: Where is BY Thermal located at DC CIME 2026 Shenzhen expo?
A1: You can find our team at DC CIME 2026 Shenzhen expo heatsink booth 14H68 in Hall 14 of Shenzhen World Exhibition Center.

Q2: What thermal cooling products will we display at booth 14H68?
A2: We showcase aluminum skiving heatsinks, liquid cold plates, GPU server radiators and customized OEM thermal hardware for AI computing and data center liquid cooling systems.

Q3: Are there special offers for orders signed on-site at DC CIME 2026 booth 14H68?
A3: Yes, all customers who confirm cooperation on-site at DC CIME 2026 Shenzhen expo heatsink booth 14H68 get exclusive expo pricing and priority production lead time.

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BY Thermal to Exhibit at Laser World of Photonics China 2026

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BY Thermal to Exhibit at Laser World of Photonics China 2026

 

BY Thermal is pleased to announce our participation in Laser World of Photonics China 2026, one of the most influential exhibitions in the laser and photonics industry.

The event will take place from March 18 to March 20, 2026, at the Shanghai New International Expo Centre. We warmly invite customers, partners, and industry professionals to visit our booth and explore our latest thermal management solutions.

laser world of photonics China BY Thermal small

Exhibition Details

 

Exhibition: Laser World of Photonics China 2026
Date: March 18–20, 2026
Location: Shanghai New International Expo Centre
Booth Number: N3.3554
Company: BY Thermal (Dongguan Baoyue Technology Co., Ltd.)

 

Discover Advanced Thermal Solutions for Laser and Electronics Cooling

 

At the exhibition, BY Thermal will showcase a range of advanced thermal management products designed for high-performance applications, including:

• Skived heat sinks
• Liquid cold plates
• Copper heat sinks
• Custom thermal solutions

Our products are widely used in laser equipment, power electronics, AI servers, energy storage systems, and industrial applications.

 

Why Visit BY Thermal at the Exhibition

 

Visitors to our booth will have the opportunity to:

• Explore high-density skived heat sink technology
• Learn about custom liquid cooling solutions
• Discuss project requirements with our engineering team
• Discover cost-effective and high-performance cooling designs

Our team will be on-site to provide technical insights and customized recommendations for your thermal management challenges.

 

About BY Thermal

 

BY Thermal is a professional manufacturer specializing in thermal management solutions, including skived heat sinks and liquid cooling systems.

With over 10 years of experience, we provide high-quality products and customized solutions for global customers in industries such as laser systems, electronics, and renewable energy.

 

FAQ – Laser World of Photonics China 2026

 

What is Laser World of Photonics China?

Laser World of Photonics China is a leading exhibition for laser and photonics technologies, attracting global companies and professionals.

 

Where is the exhibition held?

The exhibition is held at the Shanghai New International Expo Centre in Shanghai, China.

 

What does BY Thermal showcase at the exhibition?

BY Thermal showcases skived heat sinks, liquid cold plates, and custom thermal management solutions.

 

How can I visit BY Thermal?

You can visit BY Thermal at booth N3.3554 during the exhibition dates.

 

 

BY Thermal gate | Baoyue Technology
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Heat Sink Manufacturer Expands with New Manufacturing Facility in Dongguan | BY Thermal

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Heat Sink Manufacturer Expands with New Manufacturing Facility in Dongguan | BY Thermal

As a leading Heat Sink Manufacturer in China, BY Thermal has officially relocated to a larger manufacturing facility in Dongguan, China.

The new factory significantly increases production capacity for skived heat sinks, CNC machined heat sinks, vapor chambers, cold plates, and custom liquid cooling solutions, allowing us to deliver faster lead times and support larger OEM and ODM projects.

BY Thermal heat sink manufacturing factory in Dongguan China

A New Milestone for BY Thermal's Growth

Dongguan Baoyue Technology Co., Ltd. (BY Thermal), is proud to announce the successful relocation of our manufacturing facility to a new and upgraded factory in Dongguan, China.
 
This strategic move marks an important milestone in our company’s development, enabling us to enhance production capacity, improve manufacturing efficiency, and better serve our global customers.
 
As demand for advanced thermal management solutions continues to grow across industries such as power electronics, AI servers, and renewable energy, the new facility positions BY Thermal for long-term expansion.
 

Expanded Production Capacity and Advanced Manufacturing Capabilities

The new factory significantly increases our production capacity and integrates more advanced manufacturing equipment.

Our upgraded facility supports a wide range of thermal solution manufacturing processes, including:

• Skiving fin heat sink production
• CNC machining
• Liquid cold plate manufacturing
• Brazing and welding processes
• Surface treatment and finishing

With improved workflow and optimized production lines, BY Thermal can now deliver higher efficiency, shorter lead times, and consistent product quality.

ItemBeforeNow
Factory Area6,000㎡19,000㎡
CNC Machines3570
Production Capacity100k pcs/month300k pcs/month
Engineers38
Countries Served10+20+

Supporting the Growing Demand for Thermal Management Solutions

The relocation reflects the rapid growth of the thermal management industry driven by high-power electronics and emerging technologies.

Applications such as AI computing, electric vehicles, energy storage systems, and laser equipment require increasingly efficient cooling solutions.

The new facility allows BY Thermal to meet these demands with enhanced engineering support and scalable manufacturing capabilities.

Enhanced Customer Support and Customization Capabilities

With the new factory, BY Thermal strengthens its ability to provide customized thermal solutions.

We offer:

• Custom heat sink design and optimization
• Thermal simulation and analysis
• Prototype development
• Mass production

Our engineering team works closely with customers to deliver tailored cooling solutions that meet specific performance and application requirements.

Commitment to Quality and Long-Term Development

The new facility is designed to meet international manufacturing standards and supports BY Thermal’s commitment to quality, innovation, and customer satisfaction.

With improved infrastructure, advanced equipment, and an experienced team, we continue to provide reliable thermal management solutions for customers worldwide.

Visit BY Thermal in Dongguan

We warmly welcome customers and partners to visit our new manufacturing facility in Dongguan.

BY Thermal remains committed to delivering high-quality heat sinks and liquid cooling solutions, and we look forward to building long-term partnerships with clients around the world.

FAQ – BY Thermal Factory Relocation

Why did BY Thermal relocate its factory?

The relocation was driven by the need to expand production capacity and improve manufacturing efficiency to meet growing global demand.

What products are manufactured in the new facility?

The new facility produces skived heat sinks, liquid cold plates, and custom thermal management solutions.

Where is the new factory located?

The new facility is located in Dongguan, China, a major manufacturing hub.

Does the relocation affect product quality?

No, the new factory enhances product quality through improved equipment and production processes.

Looking for a Reliable Heat Sink Manufacturer?

Every application has unique thermal requirements.

Whether you need a custom skived heat sink, extruded aluminum heat sink, or a complete thermal management solution, our engineering team can help identify the most cost-effective design based on your power dissipation, airflow conditions, and space constraints.
 
Contact us today for a free engineering consultation and heat sink recommendation.
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2025 BY Thermal team-building
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Unforgettable Team-Building Event

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Unforgettable Team-Building Event: Strengthening Bonds and Fostering Collaboration

Dongguan Baoyue Electronic Hardware Technology Co., Ltd., or BY Thermal for short, was founded in 2016. We specialize in OEM customization, excelling in two core areas.

First, our factory manufactures diverse high – quality heatsinks and components. These include skived fin heatsinks, extruded aluminum heatsinks, liquid cooling plates, stamping heatsinks, heat pipe heatsinks, and precision CNC – machined parts.

Second, we rank among China’s top skived fin machine manufacturers.

From August 7th to 8th, our company hosted a two – day team – building event in Guangzhou. Aimed at boosting teamwork, communication, and camaraderie, it mixed fun activities, challenges, and growth opportunities (both personal and professional).

This event proved a huge success, leaving a lasting mark on all participants. It offered a much – needed break from daily work. More importantly, it acted as a platform. Here, team members deepened mutual understanding, built trust, and strengthened working relationships. Skills and experiences from it will surely lift workplace performance and productivity.

Reflecting on this memorable event, we’re reminded to keep investing in employees. We should also foster a collaboration – centered culture. Looking ahead, we anticipate uniting as a team, learning from each other, and achieving great feats.

Stay tuned for updates on our company’s latest news!
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Liquid Cooling Loop and Cold Plate Direct to Chip for Artificial Intelligence Processors
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Auras Showcases Next-Gen Intel Oak Stream CPU Cold Plates at Computex 2025

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Auras Showcases Next-Gen Intel Oak Stream CPU Cold Plates at Computex 2025

At Computex 2025, numerous innovative cooling solutions debuted, including those for next-generation platforms. The Auras booth stood out, where the company unveiled next-gen coolers for the upcoming AMD SP7 platform and liquid cooling cold plates designed for Intel’s Oak Stream Xeon CPUs.

Auras_Intel-OKS-CPU-Cold-Plate-2
Auras_Intel-OKS-CPU-Cold-Plate-2
The star of Auras’ display? The massive Intel Oak Stream cold plates. Measuring 156.0mm x 107.5mm x 24.2mm, these plates are significantly larger than AMD SP7 counterparts, reflecting the thermal demands of next-gen Xeon processors.
 
Industry rumors suggest Intel recently adjusted its Oak Stream socket design—though specifics remain unclear. The challenge? Original sockets for 16-channel memory CPUs were too wide to fit in half-width compute sleds alongside 16 DIMM modules per side. While the socket was tweaked, half-width platforms may still face integration hurdles with the new design.
Auras_Intel-OKS-CPU-Cold-Plate-1
Intel appears to retain its four-post retention mechanism for Oak Stream, but the actual retention design may evolve in the next generation.

 

As AI and HPC drive higher compute demands, liquid cooling will become ubiquitous. While 2U servers may skip it next-gen, accelerated servers and data centers will increasingly adopt liquid cooling as standard. Spotting early-stage cold plate designs like Auras’ offers a sneak peek into Oak Stream’s potential—even without a motherboard or chip on display.

 

Stay tuned for more updates on next-gen cooling tech and Intel’s Oak Stream platform!
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Cutting-Edge Shovel Tooth Machines Showcase at Shenzhen Exhibition: Revolutionizing the Industry

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Cutting-Edge Shovel Tooth Machines Showcase at Shenzhen Exhibition: Revolutionizing the Industry

From June 4th to June 6th, BY Thermal made a splash at the Shenzhen Thermal Conductivity and Heat Dissipation Exhibition. We showcased state – of – the – art shovel tooth machines to industry pros, potential clients, and enthusiasts. This three – day event served as a premier platform. It highlighted our equipment’s latest advancements, especially its performance, reliability, and thermal – management – tailored innovations.

Beyond product showcasing, the exhibition served as a vital platform for us to connect with industry peers. Firstly, we stayed updated on the latest thermal – conductivity and heat – dissipation trends, as well as cutting – edge tech developments. Moreover, we forged valuable, long – lasting relationships—meaningful conversations with exhibitors, suppliers, and potential partners unfolded naturally. In these dialogues, we shared insights, experiences, and ideas, laying the groundwork for future thermal – management collaborations.

 

As the exhibition wraps up successfully, we’re brimming with excitement for upcoming opportunities. Attendees’ positive responses act as a powerful fuel, driving us to keep innovating and refining products. Our core aim remains clear: to meet evolving customer needs in thermal management. Additionally, we’ll leverage the exhibition’s momentum to expand market presence and push forward thermal – conductivity and heat – dissipation tech advancements.

 

If you missed the event or want to learn more about our shovel tooth machines and their thermal – management applications, don’t hesitate to contact our sales team. Our dedicated professionals will gladly assist, sharing comprehensive product and service information tailored to your needs.

 

Last but not least, thanks to all who visited our booth! We deeply appreciate your interest and eagerly look forward to building mutually beneficial partnerships moving forward.
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