AI Server Liquid Cooling Solutions Custom Liquid Cooling for AI Servers & GPU Clusters
AI servers generate extreme heat density, requiring advanced liquid cooling solutions.
We design and manufacture high-performance cold plates for GPU, CPU, and AI computing systems, ensuring efficient heat dissipation and long-term reliability.
- ✓ 0.05mm Skived Fin Capability
- ✓ Copper Microchannel Cold Plates
- ✓ Thermal Simulation & Engineering Support
- ✓ Prototype Lead Time: 15-25 Days
→ Send your drawings to get engineering feedback within 24 hours.
Challenges in AI Server Cooling
With the rapid growth of AI computing, modern servers face unprecedented thermal challenges:
- High heat flux from GPUs and AI chips
- Compact server architecture with limited airflow
- Increasing power density exceeding air cooling limits
- Demand for long-term stability and reliability
Traditional air cooling is no longer sufficient. Liquid cooling solutions, especially cold plates, have become essential for AI infrastructure.
Our AI Cooling Solutions
1. Custom Liquid Cold Plates
We design copper and aluminum cold plates optimized for high heat flux applications such as GPU and CPU cooling.
2. Skived Fin Heat Sink Integration
Ultra-thin skived fins (as low as 0.05mm) maximize heat transfer efficiency in compact spaces.
3. Microchannel Cooling Technology
Advanced microchannel structures enhance liquid flow and improve heat dissipation performance.
4. Hybrid Cooling Structures
We combine heat pipes, CNC machining, and skiving processes to create optimized thermal solutions.
Engineering & Manufacturing Capabilities
- ✓ Fin Thickness: 0.05mm – 2mm
- ✓ Materials: Copper, Aluminum
- ✓ Processes: Skiving, CNC Machining, Brazing, Friction Welding
- ✓ Thermal Simulation & Optimization
- ✓ Leak Testing & Reliability Validation
Our engineering team supports full-cycle development from thermal design to mass production.
Applications
AI Servers & Data Centers
Machine Learning Infrastructure
GPU Cooling Systems
Memory Liquid Cooling
High Performance Computing (HPC)
Cloud Computing Hardware
Why Choose Us
- ✓ Specialized in high-power thermal solutions
- ✓ Strong experience in AI & GPU cooling projects
- ✓ In-house manufacturing with strict quality control
- ✓ Flexible customization based on your design
- ✓ Engineering response within 24 hours
Start Your AI Cooling Project Today
Looking for a reliable partner for AI server cooling solutions?
→ Send us your drawings or project requirements, and our engineers will provide professional feedback within 24 hours.
FAQ
Q: Why is liquid cooling better than air cooling for AI servers?
A: Modern AI GPUs and CPUs exceed 1000W TDP, far beyond air cooling limits. Liquid cooling, especially direct-to-chip cold plates, offers up to 25× higher heat transfer efficiency and is essential for high-density AI clusters.
Q: What is a microchannel cold plate and how does it work?
A: A microchannel cold plate is a metal block with tiny internal fins or channels. Coolant flows through, absorbing heat directly from the chip surface. Our skived fin technology creates fins as thin as 0.05mm to maximize surface area and heat dissipation.
Q: Can you customize cold plates for our specific GPU server design?
A: Yes. We offer full customization from design to mass production. Send us your drawings, and our engineers will provide professional feedback within 24 hours.
Q: What are the benefits of skived fin heat sinks in AI cooling?
A: Skived fin heat sinks are carved from a single metal block, eliminating thermal interface resistance. This creates ultra-thin, high-density fins that deliver superior cooling for high-heat-flux chips in a compact form factor.